435 Products

Member: $152.00

Nonmember: $305.00

IPC/WHMA-A-620C: ケーブル・ワイヤーハーネス組立の要求事項及び許容基準 - Japanese

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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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IPC-7711/21C: Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen - German

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IPC-7711/21C: Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen - German

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IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English

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IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline

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IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility

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IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English

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IPC-J-STD-003C-WAM1: Solderability Tests for Printed Boards

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-7091: Design and Assembly Process Implementation of 3D Components

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IPC-7091: Design and Assembly Process Implementation of 3D Components

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IPC-2226A: Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

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IPC-6013D:Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

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IPC-4552A: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

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IPC/WHMA-A-620C-DE: Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

Member: $221.00

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IPC-7711/21C REDLINE: Rework, Modification and Repair of Electronic Assemblies - Redline

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IPC-4550-FAM: Plating Specifications