8 Products

Member: $0.00

Nonmember: $0.00

IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

Member: $47.00

Nonmember: $93.00

JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

Member: $84.00

Nonmember: $168.00

IPC-HM-860: Specification for Multilayer Hybrid Circuits

Member: $84.00

Nonmember: $168.00

IPC-HDBK-005: Guide to Solder Paste Assessment

Member: $84.00

Nonmember: $168.00

IPC-D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

Member: $47.00

Nonmember: $93.00

IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

Member: $47.00

Nonmember: $93.00

IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films

Member: $47.00

Nonmember: $93.00

IPC-3406: Guidelines for Electrically Conductive Surface Mount Adhesives