IPC-J-STD-001G-AM1: 焊接的电⽓和电⼦组件要求 修订本

IPC-J-STD-001G-AM1: Requirements for Soldered Electrical and Electronic Assemblies

IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirements

IPC-HDBK-005: 焊膏评估指南

IPC/JEDEC-9707-AM1: Spherical Bend Test Method for Characterization of Board Level Interconnects

IPC-J-STD-001GS: J-STD-001G焊接的电气和电子组件要求航天和军事应用电子部件补充标准

IPC-HDBK-620: Handbook and Guide to IPC-D-620 & IPC/WHMA-A-620

IPC-1753-WAM 1: Laboratory Report Standard - English

IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard

IPC/WHMA-A-620C-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C

IPC-WHMA-A-620C-Space: 航天应用电子部件补充标准

IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用

IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

IPC-CC-830C: 印制线路组件用电气绝缘化合物的鉴定及性能

IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

J-STD-001F: J-STD-001 Revision E to Revision F Redline Comparison Document

IPC-A-610F: IPC-A-610 Revision E to Revision F Redline Comparison Document

IPC-A-610F-DK: Godkendelseskrav for elektronikprodukter

IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

IPC-A-610F: Acceptability of Electronic Assemblies

J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures