15 Products

Member: $0.00

Nonmember: $0.00

IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

Member: $84.00

Nonmember: $168.00

IPC-SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting

Member: $47.00

Nonmember: $93.00

IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

Member: $47.00

Nonmember: $93.00

IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

Member: $47.00

Nonmember: $93.00

IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

Member: $47.00

Nonmember: $93.00

IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

Member: $40.00

Nonmember: $74.00

2221A: Generic Standard on Printed Board Design

Member: $84.00

Nonmember: $168.00

IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

Member: $84.00

Nonmember: $168.00

IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies

Member: $84.00

Nonmember: $168.00

IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

Member: $84.00

Nonmember: $168.00

IPC-9850A: Surface Mount Placement Equipment Characterization

Member: $47.00

Nonmember: $93.00

IPC-9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

Member: $58.00

Nonmember: $108.00

IPC-T-50J: SUPERSEDED BY T-50K

Member: $47.00

Nonmember: $93.00

IPC-7525B: Stencil Design Guidelines

Member: $84.00

Nonmember: $168.00

IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components