IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

J-STD-001F: J-STD-001 Revision E to Revision F Redline Comparison Document

IPC-A-610F: IPC-A-610 Revision E to Revision F Redline Comparison Document

IPC-A-610F-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử

IPC-A-610F: Acceptability of Electronic Assemblies

J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

J-STD-001F-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

J-STD-030A: Selection and Application of Board Level Underfill Materials

IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

IPC-HDBK-005: Guide to Solder Paste Assessment

IPC-SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting