IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies
IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
IPC/WHMA-A-620A-DE: Rev A superseded by Rev B
J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes
D-859: Design Standard for Thick Film Multilayer Hybrid Circuits
IPC-TF-870: Qualification and Performance of Polymer Thick Film Printed Boards
D-356B: Bare Substrate Electrical Test Data Format
IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...
IPC-9199: Statistical Process Control (SPC) Quality Rating
IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components