69 Products

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J-STD-001F-WAM1-CN: 焊接的电气和电子组件要求修订版F附修订本1

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IPC-7530-CN: 群焊工艺温度曲线指南(再流焊和波峰焊)

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J-STD-001FS-CN: 焊接的电气和电子组件要求航天应用电子部件补充标准

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IPC-6012DA-CN: 刚性印制板的鉴定及性能规范汽车要求附件

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T-50M-CN(D)1: 电子电路互连与封装术语及定义

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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos

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IPC-A-610F-SP: Aceptabilidad de Ensambles Electrónicos

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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...

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IPC-A-610F-FR: Acceptabilité des assemblages électroniques

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J-STD-001F-IT: Requisiti per la Brasatura degli Assemblaggi Elettrici ed Elettronici

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IPC-A-610F-IT: IPC-A-610F Accettabilità degli Assemblaggi Elettronici

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IPC-A-610F-DE: Abnahmekriterien für elektronische Baugruppen

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IPC-6012DA-DE: Ergänzung für Anwendungen der Automobilbranche zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten

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Nonmember: $131.00

IPC-CI-408: Design & Application Guidelines for the Use of Solderless Surface Mount Connectors

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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

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J-STD-030A: Selection and Application of Board Level Underfill Materials

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

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J-STD-001F: J-STD-001 Revision E to Revision F Redline Comparison Document

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IPC-A-610F: IPC-A-610 Revision E to Revision F Redline Comparison Document

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-A-610F: Acceptability of Electronic Assemblies

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies