IPC-2591: Datenaustausch in der vernetzten Fabrik (CFX)

IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1

IPC-HERMES-9852: The Global Standard for Machine-to-Machine Communication in SMT Assembly

IPC-1791-Amendment 1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1

IPC-2591: Connected Factory Exchange (CFX)

IPC-CC-830C: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

IPC-D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films

IPC-3406: Guidelines for Electrically Conductive Surface Mount Adhesives

2221A: Generic Standard on Printed Board Design

IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies

IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

IPC-9850A: Surface Mount Placement Equipment Characterization

IPC-9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

IPC-T-50J: SUPERSEDED BY T-50K

IPC-7525B: Stencil Design Guidelines

IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components