38 Products

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-A-610E-EE: Elektroonikakoostude vastavusnõuded

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IPC-A-610E-HU: Elektronikai szerelvények elfogadhatósága

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IPC-A-610F-HU: Elektronikai szerelvények elfogadhatósága

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J-STD-001E-HU: Villamos és elektronikai szerelvények forrasztási követelményei

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IPC-A-610E-CZ: Kritéria přijatelnosti elektronických sestav

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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

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IPC-HDBK-005: Guide to Solder Paste Assessment

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IPC-D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

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IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films

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IPC-3406: Guidelines for Electrically Conductive Surface Mount Adhesives

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IPC-A-610E: Acceptability of Electronic Assemblies

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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

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IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

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IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards

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IPC-2581B-WAM1: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

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IPC-9241: Guidelines for Microsection Preparation

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J-STD-609B: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free)...

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J-STD-046: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers