15 Products

Member: $47.00

Nonmember: $93.00

IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

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IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

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IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

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2221A: Generic Standard on Printed Board Design

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IPC-1072: Intellectual Property Protection in Electronic Assembly Manufacturing

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IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations

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J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1

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IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...

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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards

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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC-7801: Reflow Oven Process Control Standard

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IPC-7092: Design and Assembly Process Implementation for Embedded Components