12 Products

Member: $0.00

Nonmember: $0.00

IPC-A-610DC-Telecom Addendum

Member: $0.00

Nonmember: $0.00

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

Member: $0.00

Nonmember: $0.00

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

Member: $47.00

Nonmember: $93.00

IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

Member: $65.00

Nonmember: $131.00

D-356B: Bare Substrate Electrical Test Data Format

Member: $65.00

Nonmember: $131.00

IPC-9199: Statistical Process Control (SPC) Quality Rating

Member: $47.00

Nonmember: $93.00

IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

Member: $47.00

Nonmember: $93.00

IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

Member: $47.00

Nonmember: $93.00

IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

Member: $40.00

Nonmember: $74.00

2221A: Generic Standard on Printed Board Design

Member: $84.00

Nonmember: $168.00

IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

Member: $84.00

Nonmember: $168.00

IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components