59 Products

Member: $47.00

Nonmember: $93.00

IPC-1072: Intellectual Property Protection in Electronic Assembly Manufacturing

Member: $84.00

Nonmember: $168.00

IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations

Member: $27.00

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J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1

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Nonmember: $93.00

IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...

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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards

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IPC-6012DS-SP: Adición de aplicaciones de aviónica militar y espacial del IPC-6012D, Clasificación y especificación de...

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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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IPC-7801: Reflow Oven Process Control Standard

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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J-STD-001FS-SP: Adición de dispositivos electrónicos para aplicaciones espaciales del IPC J-STD-001F Requisitos Para Uniones Eléctricas...

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

Member: $28.00

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J-STD-001F: J-STD-001 Revision E to Revision F Redline Comparison Document

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IPC-A-610F: IPC-A-610 Revision E to Revision F Redline Comparison Document

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IPC-A-610F: Acceptability of Electronic Assemblies

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-A-610F-SP: Aceptabilidad de Ensambles Electrónicos

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Nonmember: $93.00

J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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J-STD-030A: Selection and Application of Board Level Underfill Materials