IPC-J-STD-001G-AM1: はんだ付される電気及び電子組立品に関する要件事項 改訂1

IPC-J-STD-001G-AM1: 焊接的电⽓和电⼦组件要求 修订本

IPC-J-STD-001G-AM1: Requirements for Soldered Electrical and Electronic Assemblies

IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirements

IPC-HDBK-005: 焊膏评估指南

IPC/JEDEC-9707-AM1: Spherical Bend Test Method for Characterization of Board Level Interconnects

IPC-J-STD-001GS: J-STD-001G焊接的电气和电子组件要求航天和军事应用电子部件补充标准

IPC-HDBK-620: Handbook and Guide to IPC-D-620 & IPC/WHMA-A-620

IPC-1753-WAM 1: Laboratory Report Standard - English

IPC-J-STD-001GS: はんだ付される電気及び電子組立品に関する要件事項-「宇宙·軍事用途向け追加規格

IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard

IPC/WHMA-A-620C-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C

IPC-WHMA-A-620C-Space: 航天应用电子部件补充标准

IPC/JEDEC-J-STD-033D: Manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo y/o al proceso

IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用

IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

IPC-CC-830C: 印制线路组件用电气绝缘化合物的鉴定及性能

IPC/WHMA-A-620C: ケーブル・ワイヤーハーネス組立の要求事項及び許容基準 - Japanese

IPC-7535: Requirements for Solder Dross Reduction Chemicals 锡渣抗氧化还原剂要求

IPC-9262: Specification for Characterization and Verification of Assembly Level Automatic Optical Inspection Equipment 组装行业应用之AOI设备的特性描述与鉴定

IPC-2581B-WAM1: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

IPC-9241: Guidelines for Microsection Preparation

IPC-1782: 电子产品的制造和供应链可追溯性标准

IPC-A-610F-AM1: Acceptabilitatea Ansamblurilor Electronice Amendament 1