32 Products

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IPC-J-STD-004B-WAM1: はんだ付用フラックスに関する要求事項

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IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-A-610E-EE: Elektroonikakoostude vastavusnõuded

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IPC-A-610E-JP: 電子組立品の許容基準

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IPC-A-610F-JP: 電子組立部品の許容基準

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A-610DJP(D)1: Acceptability of Electronic Assemblies

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J-STD-005-JP: Requirements for Soldering Pastes - Includes Amendment 1

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J-STD-004A-JP: Requirements for Soldering Fluxes

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IPC-7711/21B-HU: Elektronikai szerelvények újramunkálása, módosítása és javítása

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IPC-A-610E-HU: Elektronikai szerelvények elfogadhatósága

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IPC-A-610F-HU: Elektronikai szerelvények elfogadhatósága

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J-STD-001E-HU: Villamos és elektronikai szerelvények forrasztási követelményei

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IPC-7711/21B-CZ: Přepracování, modifikace a opravy elektronických sestav

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IPC-A-610D-CZ: Acceptability of Electronic Assemblies

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IPC-A-610E-CZ: Kritéria přijatelnosti elektronických sestav

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IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

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IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

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IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement