IPC-A-610E-RL: Acceptability of Electronic Assemblies

IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

IPC-A-610E-EE: Elektroonikakoostude vastavusnõuded

IPC-A-610E-HU: Elektronikai szerelvények elfogadhatósága

IPC-A-610F-HU: Elektronikai szerelvények elfogadhatósága

J-STD-001E-HU: Villamos és elektronikai szerelvények forrasztási követelményei

IPC-A-610E-CZ: Kritéria přijatelnosti elektronických sestav

IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

2221A: Generic Standard on Printed Board Design

IPC-A-610E: Acceptability of Electronic Assemblies

J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards