IPC-J-STD-001G-AM1: Provee requisitos para materiales de soldadura y procesos para ensambles

IPC-A-610E-RL: Acceptability of Electronic Assemblies

IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

IPC-A-610E-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử

IPC-A-610F-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử

IPC-A-610E-CZ: Kritéria přijatelnosti elektronických sestav

IPC-A-610E-SP: Aceptabilidad de Ensambles Electrónicos

J-STD-001E-SP: Requisitos de Ensambles Eléctricos y Electrónicos Soldados

IPC-A-610F-SP: Aceptabilidad de Ensambles Electrónicos

IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

IPC-A-610E: Acceptability of Electronic Assemblies

J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards

IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

J-STD-030A: Selection and Application of Board Level Underfill Materials

IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

J-STD-001F: J-STD-001 Revision E to Revision F Redline Comparison Document