68 Products

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J-STD-001F-WAM1: J-STD-001 Revision F with Amendment 1: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-A-610F-WAM1: Acceptability of Electronic Assemblies

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IPC-6012DA-CN: 刚性印制板的鉴定及性能规范汽车要求附件

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IPC-6012DA-DE: Ergänzung für Anwendungen der Automobilbranche zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten

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1071B: Intellectual Property Protection in Printed Board Manufacturing

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IPC-6012DA: Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

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IPC-9121: Troubleshooting for PCB Fabrication Processes

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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001

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IPC-4562A-WAM1: Metal Foil for Printed Board Applications

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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

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J-STD-001F: J-STD-001 Revision E to Revision F Redline Comparison Document

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IPC-A-610F: IPC-A-610 Revision E to Revision F Redline Comparison Document

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IPC-A-610F-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử

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IPC-A-610F-RO: Acceptabilitatea Ansamblurilor Electronice

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IPC-A-610F-DK: Godkendelseskrav for elektronikprodukter

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IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

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IPC-A-610F-FR: Acceptabilité des assemblages électroniques

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IPC-A-610F-DE: Abnahmekriterien für elektronische Baugruppen

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IPC-A-610F: Acceptability of Electronic Assemblies

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-A-610F-SP: Aceptabilidad de Ensambles Electrónicos

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices