200 Products

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IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

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IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components

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IPC-9501: PWB Assembly Process Simulation for Evaluation of Electronic Components

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IPC-9199: Statistical Process Control (SPC) Quality Rating

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IPC-9194: Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

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IPC-9191: General Guidelines for Implementation of Statistical Process Control (SPC)

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IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

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IPC-7912A: End-Item DPMO for Printed Circuit Board Assemblies

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IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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7095A(D)1: Design and Assembly Process Implementation for BGAs

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IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

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4104: Specification for High Density Interconnect (HDI) and Microvia Materials

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IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films

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IPC-3406: Guidelines for Electrically Conductive Surface Mount Adhesives

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2221A: Generic Standard on Printed Board Design

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IPC-A-610E: Acceptability of Electronic Assemblies

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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

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IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

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IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards

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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings