193 Products

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry

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IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries

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IPC/WHMA-A-620B-Redline

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A-620B-EE: Juhtme- ja kaablikoostude vastavusnõuded

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A-620B-TR: Kablo ve Kablo Takımları için Kabul Gereklilikleri

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IPC/WHMA-A-620B: Superseded by IPC/WHMA-A-620C: IPC/WHMA-A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC/JPCA-4921: Requirements for Printed Electronics Base Materials (Substrates)

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IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

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IPC/JEDEC J-STD-609A Errata Information

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IPC-7527: Requirements for Solder Paste Printing

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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1

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IPC-AJ-820A: Assembly & Joining Handbook

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IPC-HDBK-001E: Superseded by HDBK-001F: Handbook and Guide to Supplement J-STD-001

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J-STD-005A: Requirements for Soldering Pastes

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IPC/JEDEC-9704A: Printed Circuit Assembly Strain Gage Test Guideline

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IPC/WHMA-A-620 Test Data Tables

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IPC-9850A: Surface Mount Placement Equipment Characterization

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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

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IPC-7525B: Stencil Design Guidelines

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IPC-9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

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IPC-T-50J: SUPERSEDED BY T-50K

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IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

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IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects