IPC-2591-Version 1.1: Connected Factory Exchange (CFX)

IPC-A-610GC-Telecom: IPC-A-610G 电信补充标准

IPC-2591: 互联工厂数据交换（CFX）

IPC-HERMES-9852: 表面贴装技术组装中机器对机器通信的全球标准

IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1

IPC-HERMES-9852: The Global Standard for Machine-to-Machine Communication in SMT Assembly

IPC-2591: Échanges au sein d’une usine connectée (CFX)

IPC-2591: Intercambio en fábricas conectadas (CFX)

IPC-1791-Amendment 1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1

IPC-2591: Connected Factory Exchange (CFX)

IPC-9111: 印制电路板组装工艺的故障排除

IPC-CC-830C: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

J-STD-001F-AM1-FR: Exigences des Assemblages Électriques et Électroniques Brasés

IPC-A-610F-AM1-FR: Acceptabilité des Assemblages Électroniques

IPC-A-610F AM1-CN: 电子组件的可接受性 修订本1

IPC-1072: Intellectual Property Protection in Electronic Assembly Manufacturing

IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations

J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1

IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级

IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...

IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards

IPC-6012D-CN: 刚性印制板的鉴定及性能规范

IPC-6012DS-SP: Adición de aplicaciones de aviónica militar y espacial del IPC-6012D, Clasificación y especificación de...