IPC-HERMES-9852: 表面贴装技术组装中机器对机器通信的全球标准

IPC-9111: 印制电路板组装工艺的故障排除

IPC-2591: 互联工厂数据交换（CFX）

IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1

IPC-HERMES-9852: The Global Standard for Machine-to-Machine Communication in SMT Assembly

IPC-1791-Amendment 1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1

IPC-2591: Connected Factory Exchange (CFX)

IPC-CC-830C: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

J-STD-001F-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

IPC-A-610F-NL: Acceptatie van geassembleerde printplaten

J-STD-003C-CN-WAM1: 印制板可焊性测试

IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

2221A: Generic Standard on Printed Board Design

IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

IPC-1753: Laboratory Report Standard

9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

J-STD-030A: Selection and Application of Board Level Underfill Materials

1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2