IPC-2591-Version 1.1: Connected Factory Exchange (CFX)

IPC-A-610GC-Telecom: IPC-A-610G 电信补充标准

IPC-2591: 互联工厂数据交换（CFX）

IPC-HERMES-9852: 表面贴装技术组装中机器对机器通信的全球标准

IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1

IPC-HERMES-9852: The Global Standard for Machine-to-Machine Communication in SMT Assembly

IPC-1791-Amendment 1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1

IPC-2591: Connected Factory Exchange (CFX)

IPC-9111: 印制电路板组装工艺的故障排除

IPC-CC-830C: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

J-STD-001F: J-STD-001 Revision E to Revision F Redline Comparison Document

IPC-A-610F: IPC-A-610 Revision E to Revision F Redline Comparison Document

IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

IPC-A-610F: Acceptability of Electronic Assemblies

J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

J-STD-001F-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

IPC-A-610F-NL: Acceptatie van geassembleerde printplaten

IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards

J-STD-003C-CN-WAM1: 印制板可焊性测试