IPC-2591-Version 1.1: Connected Factory Exchange (CFX)
Electronics Assembly
36 Products
IPC-A-610GC-Telecom: IPC-A-610G 电信补充标准
IPC-2591: 互联工厂数据交换(CFX)
IPC-HERMES-9852: 表面贴装技术组装中机器对机器通信的全球标准
IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1
IPC-HERMES-9852: The Global Standard for Machine-to-Machine Communication in SMT Assembly
IPC-1791-Amendment 1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1
IPC-2591: Connected Factory Exchange (CFX)
IPC-9111: 印制电路板组装工艺的故障排除
IPC-CC-830C: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives
IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards
J-STD-001F: J-STD-001 Revision E to Revision F Redline Comparison Document
IPC-A-610F: IPC-A-610 Revision E to Revision F Redline Comparison Document
IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范
IPC-A-610F: Acceptability of Electronic Assemblies
J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies
J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures
IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly
J-STD-001F-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri
IPC-A-610F-NL: Acceptatie van geassembleerde printplaten
IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards
J-STD-003C-CN-WAM1: 印制板可焊性测试