35 Products

Member: $84.00

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J-STD-030A: Selection and Application of Board Level Underfill Materials

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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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IPC-1753: Laboratory Report Standard

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9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

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IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

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2221A: Generic Standard on Printed Board Design

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IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

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IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations