IPC-7535: Requirements for Solder Dross Reduction Chemicals 锡渣抗氧化还原剂要求
Electronics Assembly
21 Products
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IPC-9262: Specification for Characterization and Verification of Assembly Level Automatic Optical Inspection Equipment 组装行业应用之AOI设备的特性描述与鉴定
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IPC-1782: 电子产品的制造和供应链可追溯性标准
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T-50M-CN(D)1: 电子电路互连与封装术语及定义
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J-STD-001FS-CN: 焊接的电气和电子组件要求航天应用电子部件补充标准
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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...
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IPC-1601A: 印制板操作和储存指南
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IPC-7530-CN: 群焊工艺温度曲线指南（再流焊和波峰焊)
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J-STD-001F-WAM1-CN: 焊接的电气和电子组件要求修订版F附修订本1
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IPC-6012DA-CN: 刚性印制板的鉴定及性能规范汽车要求附件
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IPC-HDBK-4691: 电子组件操作用粘合剂粘接手册
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IPC-6018B-CN: 高频（微波）印制板的鉴定及性能规范
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IPC-7525B-CN: 模板设计指导
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IPC-CH-65B-CN: 印制板及组件清洗指南
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IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施
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IPC-7711/21B-FR: Reprise, Modification et Réparation des Assemblages Electroniques
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IPC-7711/21B-IT: Rilavorazione, Modifica e Riparazione di Assemblati Elettronici
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IPC-WHMA-A-620A-CN: Rev A superseded by Rev B
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J-STD-001D-IT: Requirements for Soldered Electrical and Electronic Assemblies
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A-610DRU: Acceptability of Electronic Assemblies
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2221A-CH: Generic Standard on Printed Board Design