IPC-6018B-CN: 高频(微波)印制板的鉴定及性能规范
Electronics Assembly
8 Products
IPC-7525B-CN: 模板设计指导
IPC-CH-65B-CN: 印制板及组件清洗指南
IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施
J-STD-004B-CN: 修订本 1 助焊剂要求
T-50H-CN: 电子电路互连与封装术语及定义
J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes
J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...