IPC-6012DA-DE: Ergänzung für Anwendungen der Automobilbranche zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten

IPC-2581B-WAM1: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

IPC-9241: Guidelines for Microsection Preparation

J-STD-609B: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free)...

J-STD-046: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

IPC-1782: Standard for Manufacturing and Supply Chain Traceability of Electronic Products

IPC-D-640: Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring

IPC-2223D: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-6018CS: Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High...

IPC-6018C: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

IPC-1601A: Printed Board Handling and Storage Guidelines

1071B: Intellectual Property Protection in Printed Board Manufacturing

IPC-6012DA: Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

IPC-A-610F-WAM1: Acceptability of Electronic Assemblies

J-STD-001F-WAM1: J-STD-001 Revision F with Amendment 1: Requirements for Soldered Electrical and Electronic Assemblies

IPC-9121: Troubleshooting for PCB Fabrication Processes

IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001

IPC-4562A-WAM1: Metal Foil for Printed Board Applications

IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1