IPC/WHMA-A-620C: דרישות וקבלה של הרכבות כבלים ורתמות חוטים

IPC-J-STD-001G: Provee requisitos para materiales de soldadura y procesos para ensambles

IPC-J-STD-001G: Enthält Anforderungen für Lötmaterialien und -prozesse für elektronische Baugruppen.

IPC/JEDEC-9707-AM1: Spherical Bend Test Method for Characterization of Board Level Interconnects

IPC-A-610G: Anforderungen an gelötete elektrische und elektronische Baugruppen

J-STD-001G: はんだ付される電気及び電⼦組立品に関する要件事項

IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

IPC/WHMA-A-620 Test Data Tables

IPC/WHMA-A-620B-Redline

IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

IPC/JEDEC J-STD-609A Errata Information

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-A-610E-RL: Acceptability of Electronic Assemblies

IPC-A-610DC-Telecom Addendum

IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

IPC-HDBK-620: Handbook and Guide to IPC-D-620 & IPC/WHMA-A-620