IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试
Electronics Assembly
40 Products
EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English
IPC-A-610G: Acceptability of Electronic Assemblies
J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-610G: Aceptabilidad de ensambles electrónicos
IPC-J-STD-001G-AM1: J-STD-001G-AM1-SP / Provee requisitos para materiales de soldadura y procesos para ensambles
J-STD-006C-AM1: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
IPC-A-610G: Godkendelseskrav for elektronikprodukter
IPC-A610G: Acceptatie van geassembleerde printplaten
IPC-J-STD-001G: Krav til loddede elektriske og elektroniske produkter
IPC-J-STD-001G: Eisen voor gesoldeerde elektrische en elektronische geassembleerde printplaten
IPC-J-STD-001GS: Adenda para dispositivos electrónicos utilizados en aplicaciones militares y espaciales, realizada al documento IPC...
IPC-J-STD-001G: Provee requisitos para materiales de soldadura y procesos para ensambles
IPC-J-STD-001G: 焊接的电⽓和电⼦组件要求 - Chinese
IPC-A-610G: 电⼦组件的可接受性 -Chinese
IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility
IPC-J-STD-003C-WAM1&2-English: Solderability Tests for Printed Boards
IPC-A-640: 光纤,光缆和混合线束组件的验收要求
IPC-A-620B-S-CN: IPC/WHMA-A-620B航天应用电子部件补充标准
IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
IPC-1072-AM1: Intellectual Property Protection in Electronic Assembly Manufacturing
IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard
IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards
IPC-A-620C-NL: Eisen en acceptatie van kabel en draadboom assemblage