IPC-A-610F-IT-WAM1: Accettabilità degli Assemblaggi Elettronici
IPC-HDBK-850: Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for...
IPC-AJ-820A: Assembly & Joining Handbook
IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards
IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies
J-STD-001FS-WAM1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic...
IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies
IPC/WHMA-A-620C: Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-9241: Guidelines for Microsection Preparation
1601A: Printed Board Handling and Storage Guidelines
1071B: Intellectual Property Protection in Printed Board Manufacturing
IPC-A-610F-WAM1: Acceptability of Electronic Assemblies
J-STD-001F-WAM1: J-STD-001 Revision F with Amendment 1: Requirements for Soldered Electrical and Electronic Assemblies
IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001
IPC-4562A-WAM1: Metal Foil for Printed Board Applications
IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations
IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...
IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards
IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards
IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
J-STD-001FS: Space Applications Electronic Hardware Addendum to J-STD-001F
IPC-7092: Design and Assembly Process Implementation for Embedded Components
IPC-A-610F: Acceptability of Electronic Assemblies
J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies