J-STD-006C-AM1: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
IPC/WHMA-A-620C: 케이블 및 와이어 하네스 어셈블리들에 대한 요건들 및 수용
IPC-J-STD-001G: 솔더링된 전기 및 전자 어셈블리들에 대한 요건들
IPC-7711/21C: 전자 어셈블리들의 리웤, 변경 및 수리
IPC-A-610G: 전자 어셈블리들의 허용 가능성
EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English
IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility
IPC-J-STD-003C-WAM1: Solderability Tests for Printed Boards
IPC-A-610G: Acceptability of Electronic Assemblies
J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies
IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard
IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards
IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies
J-STD-001FS-WAM1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic...