13 Products

Member: $79.00

Nonmember: $155.00

J-STD-030A: Selection and Application of Board Level Underfill Materials

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Nonmember: $109.00

IPC-1752A WAM1&2: Materials Declaration Management with Amendments 1 & 2

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Nonmember: $83.00

IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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Nonmember: $83.00

J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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Nonmember: $155.00

IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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IPC-A-610F-SP: Aceptabilidad de Ensambles Electrónicos

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IPC-A-610F-DE: Abnahmekriterien für elektronische Baugruppen

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IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards

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IPC-A-610F: Acceptability of Electronic Assemblies

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-003C WAM1: Solderability Tests for Printed Boards

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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IPC-1753: Laboratory Report Standard