IPC-2591-Version 1.1: Connected Factory Exchange (CFX)

IPC-A-610GC: Telecom Addendum to IPC-A-610 Revision G Acceptability of Electronic Assemblies

IPC-2591: 互联工厂数据交换（CFX）

IPC-HERMES-9852: 表面贴装技术组装中机器对机器通信的全球标准

IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1

IPC-HERMES-9852: The Global Standard for Machine-to-Machine Communication in SMT Assembly

IPC-1791-AM1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1

IPC-2591: Datenaustausch in der vernetzten Fabrik (CFX)

IPC-2591: Connected Factory Exchange (CFX)

IPC-9111: 印制电路板组装工艺的故障排除

IPC-9111: Troubleshooting for Printed Board Assembly Processes

IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirement

IPC-J-STD-001GS: J-STD-001G焊接的电气和电子组件要求航天和军事应用电子部件补充标准

IPC-J-STD-001GS: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical...

IPC-HDBK-620: Handbook and Guide to IPC-D-620 & IPC/WHMA-A-620

IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard

IPC/WHMA-A-620C-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C

IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用

IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

J-STD-003C WAM1: Solderability Tests for Printed Boards

IPC-A-610F-DE: Abnahmekriterien für elektronische Baugruppen

IPC-A-610F: Acceptability of Electronic Assemblies

J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards