IPC-1072: Intellectual Property Protection in Electronic Assembly Manufacturing
Electronics Assembly
16 Products
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IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations
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IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...
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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards
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IPC-6012C-CN: 刚性印制板的鉴定及性能规范
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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides
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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen
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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
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IPC-7092: Design and Assembly Process Implementation for Embedded Components
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IPC-J-STD-020E: Clasificación de la sensibilidad a la humedad / reflujo de dispositivos de montaje superficial...
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IPC-2221B: Generic Standard on Printed Board Design
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IPC-J-STD-004B-WAM1: はんだ付用フラックスに関する要求事項
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IPC-AJ-820A: Assembly & Joining Handbook
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J-STD-005A-JP: ソルダペーストに関する要求事項
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J-STD-005A: Requirements for Soldering Pastes
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IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards