25 Products

Member: $92.00

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IPC-9241: Guidelines for Microsection Preparation

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IPC-1782: Standard for Manufacturing and Supply Chain Traceability of Electronic Products

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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos

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IPC-2223D: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

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IPC-6018CS: Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High...

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IPC-6018C: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

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IPC-A-610F-IT-WAM1: Accettabilità degli Assemblaggi Elettronici

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IPC-D-640: Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring

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IPC-1601A: Guía para el manejo y almacenamiento de tarjetas impresas

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1601A: Printed Board Handling and Storage Guidelines

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J-STD-001F-WAM1: J-STD-001 Revision F with Amendment 1: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-A-610F-WAM1: Acceptability of Electronic Assemblies

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IPC-6012DA: Automotive Applications Addendum to IPC-6012D, Qualficiation and Performance Specification for Rigid Printed Boards

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1071B: Intellectual Property Protection in Printed Board Manufacturing

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IPC-9121: Troubleshooting for PCB Fabrication Processes

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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001

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IPC-4556-AM1: is a Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendment...

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IPC-4562A-WAM1: Metal Foil for Printed Board Applications

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IPC-1072: Intellectual Property Protection in Electronic Assembly Manufacturing

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IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations

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IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...

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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards

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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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IPC-7092: Design and Assembly Process Implementation for Embedded Components