169 Products

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IPC/WHMA-A-620C-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C

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IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

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IPC-J-STD-001G: 焊接的电⽓和电⼦组件要求 - Chinese

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IPC-J-STD-001G: Nõuded joodetud elektri- ja elektroonikakoostudele

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IPC-7801: 再流焊炉工艺控制标准 - Chinese

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IPC-A-610G: 电⼦组件的可接受性 -Chinese

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IPC/WHMA-A-620C: ケーブル・ワイヤーハーネス組立の要求事項及び許容基準 - Japanese

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English

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IPC-7711/21C: Reparación, Modificación y Reparación de Ensambles Electrónicos - Spanish

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IPC-7711/21C: Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen - German

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IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility

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IPC-WHMA-A-620C: Requisitos y Aceptabilidad de Cables y Mazos de Cables - Spanish

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IPC/WHMA-A-620C: 线缆及线束组件的要求与验收 - Chinese

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IPC-J-STD-003C-WAM1: Solderability Tests for Printed Boards

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IPC-7711/21C-电子组件的返工、修改和维修

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-7535: Requirements for Solder Dross Reduction Chemicals 锡渣抗氧化还原剂要求

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-2291: Design Guideline for Printed Electronics

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J-STD-005A: Requirements for Soldering Pastes

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IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard

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IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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J-STD-001F-WAM1-CN: 焊接的电气和电子组件要求修订版F附修订本1