169 Products

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IPC/WHMA-A-620C: 线缆及线束组件的要求与验收 - Chinese

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IPC-J-STD-003C-WAM1: Solderability Tests for Printed Boards

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IPC-7711/21C-电子组件的返工、修改和维修

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-7535: Requirements for Solder Dross Reduction Chemicals 锡渣抗氧化还原剂要求

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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-2291: Design Guideline for Printed Electronics

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J-STD-030A: Selection and Application of Board Level Underfill Materials

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IPC-1752A WAM1&2: Materials Declaration Management with Amendments 1 & 2

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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J-STD-005A: Requirements for Soldering Pastes

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IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard

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IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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J-STD-001F-WAM1-CN: 焊接的电气和电子组件要求修订版F附修订本1

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IPC-A-620B-S-CN: IPC/WHMA-A-620B航天应用电子部件补充标准

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IPC-9262: Specification for Characterization and Verification of Assembly Level Automatic Optical Inspection Equipment 组装行业应用之AOI设备的特性描述与鉴定

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IPC-6012DA-DE: Ergänzung für Anwendungen der Automobilbranche zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten

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J-STD-001FS-CN: 焊接的电气和电子组件要求航天应用电子部件补充标准

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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos

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IPC-7530-CN: 群焊工艺温度曲线指南(再流焊和波峰焊)