IPC-A-610DC-Telecom Addendum

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

D-322: Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes

D-356B: Bare Substrate Electrical Test Data Format

IPC-D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

IPC-9199: Statistical Process Control (SPC) Quality Rating

IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films

IPC-3406: Guidelines for Electrically Conductive Surface Mount Adhesives

IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components