IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes
D-322: Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes
D-356B: Bare Substrate Electrical Test Data Format
IPC-9199: Statistical Process Control (SPC) Quality Rating
IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components