10 Products

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IPC-A-610DC-Telecom Addendum

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

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IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies

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J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

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D-322: Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes

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D-356B: Bare Substrate Electrical Test Data Format

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IPC-9199: Statistical Process Control (SPC) Quality Rating

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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components