IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

J-STD-001F-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

J-STD-001F-JP: はんだ付される電気及び電子組立品に関する要件事項

J-STD-001F-IT: Requisiti per la Brasatura degli Assemblaggi Elettrici ed Elettronici

IPC-A-610F-IT: IPC-A-610F Accettabilità degli Assemblaggi Elettronici

IPC-A-610F-DE: Abnahmekriterien für elektronische Baugruppen

IPC-SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting

JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

IPC-HM-860: Specification for Multilayer Hybrid Circuits

IPC-HDBK-005: Guide to Solder Paste Assessment

IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

2221A: Generic Standard on Printed Board Design

IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

IPC-1753: Laboratory Report Standard

9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

J-STD-030A: Selection and Application of Board Level Underfill Materials

1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2

IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives