21 Products

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IPC-HDBK-610: Handbook and Guide to Supplement IPC-A-610 (Includes IPC-A-610 B-C-D Comparisons) with Amendment 1

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IPC-A-610D-VN: Acceptability of Electronic Assemblies

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J-STD-001D-SW: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-A-610D-SW: Acceptability of Electronic Assemblies

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J-STD-001D-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

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IPC-A-610D-PL: Acceptability of Electronic Assemblies

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IPC-A-610D-FI: Acceptability of Electronic Assemblies - Finnish Language

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IPC-A-610D-DK: Acceptability of Electronic Assemblies

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J-STD-001D-SP: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-A-610DFR: Acceptability of Electronic Assemblies

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A-610DIT: Acceptability of Electronic Assemblies

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IPC-A-610D WAM1: Acceptability of Electronic Assemblies

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IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC-9191: General Guidelines for Implementation of Statistical Process Control (SPC)

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IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

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IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components

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IPC-CI-408: Design & Application Guidelines for the Use of Solderless Surface Mount Connectors

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D-859: Design Standard for Thick Film Multilayer Hybrid Circuits

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IPC-TF-870: Qualification and Performance of Polymer Thick Film Printed Boards

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IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

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IPC-HM-860: Specification for Multilayer Hybrid Circuits