IPC-HDBK-610: Handbook and Guide to Supplement IPC-A-610 (Includes IPC-A-610 B-C-D Comparisons) with Amendment 1
Electronics Assembly
12 Products
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J-STD-001D-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych
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IPC-A-610D-PL: Acceptability of Electronic Assemblies
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A-610DIT: Acceptability of Electronic Assemblies
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IPC-A-610D WAM1: Acceptability of Electronic Assemblies
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IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
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IPC-1731: 1731 - Strategic Raw Materials Supplier Qualification Profile
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IPC-CI-408: Design & Application Guidelines for the Use of Solderless Surface Mount Connectors
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D-859: Design Standard for Thick Film Multilayer Hybrid Circuits
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IPC-TF-870: Qualification and Performance of Polymer Thick Film Printed Boards
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IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum
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IPC-HM-860: Specification for Multilayer Hybrid Circuits