14 Products

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IPC-A-610DC-Telecom Addendum

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IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-001D-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

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IPC/WHMA-A-620A-PL: Rev A superseded by Rev B

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IPC-A-610D-PL: Acceptability of Electronic Assemblies

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A-610DIT: Acceptability of Electronic Assemblies

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IPC-HDBK-610: Handbook and Guide to Supplement IPC-A-610 (Includes IPC-A-610 B-C-D Comparisons) with Amendment 1

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IPC-HM-860: Specification for Multilayer Hybrid Circuits

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IPC-CI-408: Design & Application Guidelines for the Use of Solderless Surface Mount Connectors

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IPC-A-610D WAM1: Acceptability of Electronic Assemblies

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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components