28 Products

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IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

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J-STD-001D-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

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IPC-A-610D-PL: Acceptability of Electronic Assemblies

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A-610DIT: Acceptability of Electronic Assemblies

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IPC-HDBK-610: Handbook and Guide to Supplement IPC-A-610 (Includes IPC-A-610 B-C-D Comparisons) with Amendment 1

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IPC-HM-860: Specification for Multilayer Hybrid Circuits

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IPC-CI-408: Design & Application Guidelines for the Use of Solderless Surface Mount Connectors

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IPC-A-610D WAM1: Acceptability of Electronic Assemblies

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IPC-1072: Intellectual Property Protection in Electronic Assembly Manufacturing

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IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations

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J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1

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IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...

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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards

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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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J-STD-048: Notification Standard for Product Discontinuance

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC-1755 Amendment 1: Conflict Minerals Data Exchange Standard Amendment 1

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IPC-7801: Reflow Oven Process Control Standard

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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IPC-1072: Intellectual Property Protection in Electronic Assembly Manufacturing

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IPC-7801: Reflow Oven Process Control Standard

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

Member: $88.00

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IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations

Member: $49.00

Nonmember: $98.00

IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...