IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

IPC-A-610E-RL: Acceptability of Electronic Assemblies

IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

IPC-A-610E-NL: Acceptatie van Geassembleerde Printplaten

IPC-A-610F-SE: Acceptanskrav för kretskort

J-STD-001E-SE: Krav för lödda elektriska och elektroniska kretskort

IPC-A-610E-SE: Acceptanskrav för kretskort

7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie

IPC-1601-DE: Handhabung und Lagerung von Leiterplatten

J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

IPC/WHMA-A-620A-DE: Rev A superseded by Rev B

IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten

IPC-A-610E-DE: Abnahmekriterien für elektronische Baugruppen

IPC-HM-860: Specification for Multilayer Hybrid Circuits

D-356B: Bare Substrate Electrical Test Data Format

IPC-D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

IPC-9199: Statistical Process Control (SPC) Quality Rating

IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films

IPC-3406: Guidelines for Electrically Conductive Surface Mount Adhesives