58 Products

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-SM-840E-CN: 永久性阻焊剂和挠性覆盖材料的鉴定和性能规范

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IPC-CH-65B-CN: 印制板及组件清洗指南

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IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

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IPC-7525B-CN: 模板设计指导

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IPC/JEDEC-J-STD-020D-1-CN: IPC/JEDEC 非气密固态表面贴装器件潮湿/再流焊敏感度分级

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IPC-A-610E-CN: 电子组件的可接受性

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J-STD-001E-CN: Rev E superseded by Rev F

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J-STD-003C-CN-WAM1: 印制板可焊性测试

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IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

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IPC-6018B-CN: 高频(微波)印制板的鉴定及性能规范

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IPC-1601-CN: 印制板操作和贮存指南

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IPC-HM-860: Specification for Multilayer Hybrid Circuits

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IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components

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IPC-9191: General Guidelines for Implementation of Statistical Process Control (SPC)

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1756: Manufacturing Process Data Management