25 Products

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IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

Member: $84.00

Nonmember: $168.00

IPC-SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting

Member: $47.00

Nonmember: $93.00

IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

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Nonmember: $93.00

IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

Member: $65.00

Nonmember: $131.00

D-356B: Bare Substrate Electrical Test Data Format

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IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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Nonmember: $93.00

IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components

Member: $65.00

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IPC-9199: Statistical Process Control (SPC) Quality Rating

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IPC-9191: General Guidelines for Implementation of Statistical Process Control (SPC)

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IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

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IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

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2221A: Generic Standard on Printed Board Design

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IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

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IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies

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IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

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J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes

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7095B(D)1: Design and Assembly Process Implementation for BGAs

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Nonmember: $168.00

IPC-9850A: Surface Mount Placement Equipment Characterization

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Nonmember: $93.00

IPC-9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

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IPC-T-50J: SUPERSEDED BY T-50K

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IPC-7525B: Stencil Design Guidelines

Member: $84.00

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IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components