61 Products

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IPC/WHMA-A-620 Test Data Tables

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IPC/WHMA-A-620B-Redline

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IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

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IPC/JEDEC J-STD-609A Errata Information

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-2220-FAM: Design Standards for Printed Boards

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J-STD-001F-IT: Requisiti per la Brasatura degli Assemblaggi Elettrici ed Elettronici

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IPC-A-610F-IT: IPC-A-610F Accettabilità degli Assemblaggi Elettronici

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IPC-A-610F-DE: Abnahmekriterien für elektronische Baugruppen

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IPC/WHMA-A-620B-DE: Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen

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IPC/JEDEC-J-STD-033C-DE: Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/reflow- und/oder prozessempfindlicher Bauteile

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IPC-SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting

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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

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IPC-HDBK-005: Guide to Solder Paste Assessment

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IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

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IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

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IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components

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IPC-9191: General Guidelines for Implementation of Statistical Process Control (SPC)

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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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IPC-1753: Laboratory Report Standard

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9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

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J-STD-030A: Selection and Application of Board Level Underfill Materials

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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2