58 Products

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IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

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IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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J-STD-001F-IT: Requisiti per la Brasatura degli Assemblaggi Elettrici ed Elettronici

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IPC-A-610F-IT: IPC-A-610F Accettabilità degli Assemblaggi Elettronici

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IPC-A-610F-DE: Abnahmekriterien für elektronische Baugruppen

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IPC-SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting

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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

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IPC-HDBK-005: Guide to Solder Paste Assessment

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IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

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IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

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IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components

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IPC-9191: General Guidelines for Implementation of Statistical Process Control (SPC)

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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings

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IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

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IPC-1753: Laboratory Report Standard

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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

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IPC-9641: High Temperature Printed Board Flatness Guideline

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-2291: Design Guideline for Printed Electronics

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IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits