IPC-A-610F AM1-CN: 电子组件的可接受性 修订本1

IPC-1072: Intellectual Property Protection in Electronic Assembly Manufacturing

IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations

IPC-1072: Intellectual Property Protection in Electronic Assembly Manufacturing

IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations

J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1

IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级

IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...

IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards

IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...

IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards

IPC-6012D-CN: 刚性印制板的鉴定及性能规范

IPC-6012C-CN: 刚性印制板的鉴定及性能规范

IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

J-STD-048: Notification Standard for Product Discontinuance

IPC-1755 Amendment 1: Conflict Minerals Data Exchange Standard Amendment 1

IPC-7801: Reflow Oven Process Control Standard

IPC-7801: 再流焊炉工艺控制标准 - Chinese

IPC-7092: Design and Assembly Process Implementation for Embedded Components

IPC-7092: Design and Assembly Process Implementation for Embedded Components

IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings