IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
J-STD-004B-CN: 修订本 1 助焊剂要求
J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
J-004A-CN: SUPERSEDED BY J-STD-004B-CN
J-STD-005-CN WAM1: Requirements for Soldering Pastes - includes Amendment 1
IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...
J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies
IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
IPC/WHMA-A-620A-DE: Rev A superseded by Rev B
J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes
D-859: Design Standard for Thick Film Multilayer Hybrid Circuits
IPC-TF-870: Qualification and Performance of Polymer Thick Film Printed Boards
IPC-S-816: SMT Process Guideline Checklist
IPC-OI-645: Standard for Visual Optical Inspection Aids
D-356B: Bare Substrate Electrical Test Data Format
IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...
IPC-9199: Statistical Process Control (SPC) Quality Rating