16 Products

Member: $0.00

Nonmember: $0.00

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

Member: $0.00

Nonmember: $0.00

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

Member: $0.00

Nonmember: $0.00

IPC-A-610DC-Telecom Addendum

Member: $86.00

Nonmember: $171.00

IPC/WHMA-A-620A-PL: Rev A superseded by Rev B

Member: $69.00

Nonmember: $137.00

J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

Member: $84.00

Nonmember: $168.00

IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

Member: $84.00

Nonmember: $168.00

IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

Member: $84.00

Nonmember: $168.00

IPC-HDBK-610: Handbook and Guide to Supplement IPC-A-610 (Includes IPC-A-610 B-C-D Comparisons) with Amendment 1

Member: $69.00

Nonmember: $137.00

J-STD-001D-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

Member: $124.00

Nonmember: $247.00

IPC-A-610D-PL: Acceptability of Electronic Assemblies

Member: $61.00

Nonmember: $116.00

IPC-A-610D WAM1: Acceptability of Electronic Assemblies

Member: $47.00

Nonmember: $93.00

IPC-9501: PWB Assembly Process Simulation for Evaluation of Electronic Components

Member: $65.00

Nonmember: $131.00

IPC-D-325A: Documentation Requirements for Printed Boards

Member: $47.00

Nonmember: $93.00

IPC-CA-821: General Requirements for Thermally Conductive Adhesives - Single User Download

Member: $66.00

Nonmember: $131.00

D-859: Design Standard for Thick Film Multilayer Hybrid Circuits

Member: $65.00

Nonmember: $131.00

IPC-TF-870: Qualification and Performance of Polymer Thick Film Printed Boards